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Technologies
Basis Of Technology
Electrical Connectors
Nano-grain Metal
SEM, FIB, AFM pictures of metal
Scanning Electron Microscope pictures of PI
Optical Microscope pictures of PI
New Squeegee Blade Technology!
Standard wiping contact spalling
Momentum plating
Heat Exchanger and Heat Pipe
Mechanical Connectors
Diffusion Welds
Thermal Connectors
Electrical Insulators
Thermal Insulators
Products
Socket Types:
Test Sockets
Burn-In Sockets
Characterization Sockets
RF Sockets
Emulation Sockets
Production Sockets
Known Good Die (KGD) Sockets
System In a Package (SIP) Sockets
Field Replaceable Socket Examples
Packaging Types:
BGA
Land Grid Arrays
PLCC
QFP
TSOP
CSP (Chip Scale Package)
SIP (System In A Package)
Lead Frames
Tab Frames
Known Good Die
Stacked Die / Wafers
J-Lead
Gull Wing Lead
Flip Chip
RFID Tags
PCB Test Fixture
Removable Interconnect
Applications
Electronic
Reducing Cray form factor using PI
Removable Die Multi Chip Module
(test/burn-in/production)
Stacked Die / Wafers
Surface Mount Package Test Fixture
Die/Wafer Probe Card
Lead Frames
PCB/Cable Connector
PCB Test Fixtures
PCB Drill Hole/Blind Via
LCD/Cable Connector
Hard Disk drive Head Assembly
Push Button Contact
Micro-Fuses (Resetable & Blown Once)
Micro-Reed Relays
Smart Card/Smart Label
RFID Tags
Built-In Resistors
Electric
High power
Battery Terminal
EMI Shielding
Mechanical (Diffusion Welds)
Aircraft Rivet Replacement
Automotive Spot Weld
Mechanical fasteners
(temporary and permanent)
Mechanical welding
(room temperature, with pressure)
Thermal Connectors
Heat Conducting, Electrically Insulated
Publications
Brochure
Press Releases
Patents
TDR, S parameter, Eye Diagrams
Test Results
Comparing Socket Technologies
Papers on PI
MicroModules Systems Papers
Legal
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