BGA

1. Successful projects
• Particle Interconnect - Sandia Lab Known Good Die (KGD)
• Hughes Aircraft
• CTI (PI through-hole BGA socket)
• SDRAM DDR1 & 2
2. Contact types
3. Test results

Successful projects

Particle Interconnect - Sandia Lab Known Good Die (KGD)

Known-Good-Die probe/burn-in. Proof of removable die MCM-L/D/C.

• 0.030" pitch 19x19 miniBGA.
• Burn-in at 125 ° C, 168 hours.
• 0 failures, 100+ runs, no deformation.

0 failures, 11 runs shown above.	Particle Interconnect surface mount BGA socket.

Particle Interconnect - Sandia mBGA interposer schematic.	Sandia mBGA interposer

Particle Interconnect - Hughes environmental test die

Particle Interconnect removable MCM die socket.

100% of 500 die lot survived 4x Mil-Std-883C.

1. Particle Interconnect with both adhesive and mechanical hold-down of chips while accumulating 4 runs of:
• 168 hours (672 hours total) 125 ° C for burn-in (other test passed are continuous 125 ° C),
• 500 cycles (2,000 cycles total) -55 to +125 ° C fast ramp MIL-STD-883C shock test,
• 24 hours (96 hours total) in salt/fog corrosion test,
• 24 hours (96 hours total) HAST (Highly Accelerated Stress Testing) pressure chamber (30 psi, +125 ° C pressure pot),
• Results in 50,000 die lot test prior to transfer into production.
2. 96/4 Pb/Sn reflowed plated bump to spherize with special passivation configuration.
3. Die orientated same as CAD picture for clarity (see: Removable die MCM - L/D/C).
4. Note contact resistance test pads on left edge.
5. Note traces for passivation crack detection.
6. Note temperature sensors in center of die.
7. Note traces for edge crack detection.
8. Note traces for die heating.
9. Note Particle Interconnect imprint.

Particle Interconnect through-hole BGA socket

0.050" pitch, 15x15 version.

DDR1 balls fresh from factory

• Ball's surface is smooth. Grain of ball is visible.
• Typically for 5 packages with 6 sites/package.

Particle Interconnect piercing SDRAM DDR1 package balls

• Demonstrating damage free performance when exposed to excessive loading.
• 60 pounds of force on 60 balls.
• Note minor depth of penetration.

Contact types

Particle Interconnect seasaw BGA socket

BeCu spring material with Particle Interconnect bumps on opposite sides of opposite ends of beam.

Louver contact

Test results

Particle Interconnect contact resistance vs. contact force

Gold probe to top side Particle Interconnect

Particle Interconnect's very low resistance results in higher current capacity.

• 1 mm pitch BGA interposer.
• 9.2 grams contact force (.0902 N, .020 lbs, or .325 Oz.)
• Contact resistance = .00433 Ω

Particle Interconnect array top side	Particle Interconnect bottom side close up