Thermal Connector
Thermally conductive diamond particles connecting two conducting surfaces together.
Particle Interconnect via
Connecting two conducting surfaces together.
| Particle closeup | Connector closeup |
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Thermal conductivity, coefficient of thermal expansion, and density
| Reinforcement | Matrix | Inplane thermal conductivity (W/m-K) | Through-thickness thermal conductivity (W/m-K) | Inplane CTE (ppm/K) | Density (g/cm3) |
| Diamond particles | Copper | 600-1200 | 600-1200 | 5.8 | 5.9 |
| - | Copper | 400 | 400 | 17 | 8.9 |
| - | CVD diamond | 1100-1800 | 1100-1800 | 1-2 | 3.52 |
Cross-section of Particle Interconnect pad
Demonstrates uniformity & planarity of particle protrusion above photoresist.
- 0.020" diameter x 0.003" tall nickel Particle Interconnect pad on 1 oz copper.
- Using 25 micron particles. Planarity of 1/2 particle diameter.
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